Toughened, room temperature curing epoxy

Hackensack, New Jersey – Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. It combines user friendly processing with a high physical strength profile.

 

Supreme 11HTLP is formulated to have impressive toughness, which imparts high bond strength of more than 3,200psi and 20pli, respectively in the shear and peel mode. This compound bonds well to a wide variety of substrates, including metals, glass, ceramics, composites, rubbers, and plastics. Its toughness also allows it to withstand aggressive thermal cycling as well as impact and shock, and be serviceable over the temperature range of -100°F to 400°F.

 

Supreme 11HTLP has a 1:1 mix ratio by weight or volume along with a working life of 90 to 120 minutes for a 100g batch. Thorough mixing is facilitated by color coding as Part A is gray and Part B is amber. It has a high viscosity, but maintains flow properties. This system can be cured at room temperature or more rapidly at elevated temperatures. Upon curing, Supreme 11HTLP exhibits low shrinkage and dimensional stability. Additionally, it is readily machinable.

 

Featuring a volume resistivity exceeding 1,013 Ohm-cm, Supreme 11HTLP delivers reliable electrical insulation values. Resistance many chemicals, including water, oil and fuels is excellent. 100% reactive, this adhesive/sealant is available for use in 1/2 pint, pint, quart, gallon and 5 gallon container kits.