Manufacturing products, technology

Parting, grooving tool geometries for chip control; Epoxy compound for bonding, sealing

Parting, grooving tool geometries for chip control

PHOTO COURTESY OF SANDVIK COROMANT

The CoroCut 2 parting and grooving tool is now available with a -GL parting and grooving geometry and an updated -CR parting-off geometry. These geometries increase chip control in long-chip material and provide a strong edge for high-feed parting-off.

CoroCut 2 maximizes output while minimizing energy consumption and waste. The expanded geometries are geared toward machining hard-to-chip steels and parting-off operations where a strong edge is needed.

The -GL geometry is well-suited to workshops requiring better chip control in demanding ISO P components such as low-carbon steel and clean steels. It also enables increased automation as shorter chips lead to less tangling and fewer stops, reducing the need for manual handling.

The -CR geometry is suitable for a wide range of materials in parting-off operations at higher feeds or during intermittent cutting. With its strong edge and wiper design, it increases productivity and ensures excellent component quality.

Both geometries feature a rail interface, ensuring a more precise insert position and reducing movement for enhanced stability, especially when side forces are applied. They’re produced with FlashLight technology for more consistent edge line and better, more predictable tool life.

Sandvik Coromant
https://www.sandvik.coromant.com

 

Epoxy compound for bonding, sealing

Master Bond EP29LPSPND-3 is a two-component, non-drip epoxy compound with a paste consistency designed for bonding and sealing applications. The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2W/(m•K) at room temperature. It withstands cryogenic temperatures and is serviceable in the range from 4K to 250°F.

EP29LPSPND-3 features a coefficient of thermal expansion of 45-50 x 10-6 in/in/°C, a tensile strength of 6,000psi to 8,000psi, and a Shore D hardness of 70 to 80. It has a volume resistivity exceeding 1015Ω-cm at 75°F and a dielectric constant of 4.2 at 60Hz. The compound can withstand temperature cycling even at cryogenic levels.

EP29LPSPND-3 has a mix ratio of 100:65 by weight with a long working life after mixing; a 100-gram batch will yield an open time of more than five hours at 75°F. The color of Part A is clear-translucent, and Part B is amber-clear; it cures clear when applied in thin sections and has a refractive index of 1.56 at 589nm. The recommended cure schedule is either 12 to 18 hours at 130°F to 150°F or 5 to 10 hours at 150°F to 165°F. EP29LPSPND-3 is available in ounce jar, half pint, pint, quart, and gallon kits.

Master Bond
https://www.masterbond.com

May 2025
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