Epoxy adhesive resists chemicals, heat

Epoxy adhesive resists chemicals, heat

January 15, 2020

Master Bond Inc


Hackensack, New Jersey – Master Bond EP21TPHT is a two-component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient handling characteristics with a 1:1 mix ratio by weight or volume and an easily flowable mixed viscosity of 5,000cps to15,000cps.

“EP21TPHT offers a high lap shear strength of 1,600psi to1,800psi and bonds well to a variety of substrates including metals, composites, glass, ceramics, and many rubbers. It is a toughened compound with good elongation of 20% to 40%, and a relatively low tensile modulus of 30,000psi to 50,000psi at room temperature”, says Rohit Ramnath, senior product engineer. “This combination of properties makes it suitable for applications involving thermal cycling and mechanical stresses.”

EP21TPHT is an electrically insulative material with a dielectric constant of 3.9 and volume resistivity of more than 1,014Ohm-cm at 75°F. It withstands exposure to a wide range of chemicals including fuels, oils, hydrocarbons, and hydraulic fluids and has many applications in the aerospace, military, electronic, electrical, and specialty OEM industries.

It’s available for use in double-barrel syringes and gun dispensers, as well as in 1/2 pint, pint, quart, or gallon container kits.