Hackensack, New Jersey – Master Bond EP30NG is a two-part epoxy adhesive system developed for applications that require high thermal conductivity and the small amount of electrical conductivity is not a factor. It contains a specialty graphene filler which contributes to its high compressive strength and its enhanced dimensional stability. EP30NG achieves thermal conductivity of 38.15BTU•in/(ft2•hr•°F) [5.5W/(m•K)] at room temperature while its compressive strength measures 22,000psi to 24,000psi upon cure. It has a low coefficient of thermal expansion of 24 to 26x10-6 in/in/°C and exhibits a Shore D hardness of 85-95.
EP30NG is for bonding applications where some contact pressure can be applied. The minimum bond line thickness is 0.18mm, since graphene nanoparticles tend to agglomerate to form larger particles. It bonds well to a variety of substrates including metals, composites, ceramics, glass, and many plastics. The service temperature range is -60°F to 300°F.
This epoxy system is formulated to cure at room temperature or more rapidly at elevated temperatures. Part A has a thick paste consistency and Part B is a low viscosity liquid.
The product is available in 30 cc jar kits, 1/2-pint kits, and pint kits.