Two-part epoxy with dimensional stability
Developed for potting, sealing, encapsulation, and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties including a volume resistivity exceeding 1,015ohm-cm, a dielectric constant of 2.91 at 1KHz and a dissipation factor of 0.009 at 1KHz. “EP110F8-5 is an easy to use, heat curing epoxy that is ideal for applications where dimensional stability, electrical insulation properties and thermal cycling resistance are required,” said Rohit Ramnath, senior product engineer.
This two-component epoxy has a forgiving 1 to 2 mix ratio by weight with a moderate mixed viscosity of 7,000cps to 11,000cps and good flow properties. It requires an elevated temperature cure at 250°F to 300°F in 4 to 6 hours. EP110F8-5 has a pot life of 2 to 3 days at room temperature.
EP110F8-5 is a rigid system with a Shore D hardness of 70 to 80, but also maintains excellent toughness and offers an elongation of 40% to 60%. Its toughness imparts an ability to withstand thermal cycling as well as impact and vibration. In fact, it passes 10 thermal shock cycles of -55°C to +125°C. With a compressive strength of 18,000psi to 20,000psi, EP110F8-5 adheres well to a wide variety of substrates, including metals, composites, glass, and many plastics. It resists exposure to water, oils and fuels.
It is serviceable over the temperature range of -100°F to +300°F (-73°C to +149°C). Part A of EP110F8-5 is tan in color and Part B is brown. This system is available for use in 1/2 pint, pint, quart, gallon, and 5 gallon container kits.